Timing based arbitration methods and apparatuses for calibrating impedances of a semiconductor device

ABSTRACT

Systems and apparatuses are provided for an arbiter circuit for timing based ZQ calibration. An example system includes a resistor and a plurality of chips. Each of the plurality of chips further includes a terminal coupled to the resistor and a calibration circuit. The calibration circuit determines whether the resistor is available based, at least in part, on timing information that is unique to a corresponding chip of the plurality of chip. The timing information of each chip of the plurality of chips has a fixed duration of time common to the plurality of chips.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.15/630,901, filed Jun. 22, 2017. The afore-mentioned application isincorporated by reference herein, in its entirety, and for any purposes.

BACKGROUND

High data reliability, high speed of memory access, and reduced chipsize are features that are demanded from semiconductor memory. In recentyears, there has been an effort to further increase the speed of memoryaccess.

In conventional peripheral circuitries for a semiconductor memorydevice, for example, pads and data input/output circuits are arranged ina corresponding manner across layers. For example, a semiconductormemory device may include a data input/output circuit. To achieve highspeed transmission, the impedance of the data input/output circuitshould be controlled. To control the impedance, an external resistance,such as ZQ resistor may be coupled. The semiconductor memory deviceincluding a plurality of chips are generally provided with one externalZQ resistor. When two or more chips request to use the ZQ resistor atthe same time, an arbiter circuit is typically used to determine whichchip should access the ZQ resistor. Accordingly, one chip can access theZQ resistor, and a subsequent chip may access the ZQ resistor after ZQcalibration for the one chip has been completed.

For example, arbiter circuits may rely on a voltage based arbitrationscheme to determine which chip, a master chip or slave chip, has issueda ZQ calibration request. In the voltage based arbitration scheme, a ZQcalibration request issued by the master chip may have a strongpulldown, while a ZQ calibration request issued by the slave chip mayhave a weak pulldown. Thus, various states of use of the ZQ resistor maybe determined, via a ZQ pad voltage. However, chip packages withmultiple-chips and/or of a low-power consumption type may not be able toeffectively differentiate between multiple states via the ZQ pad voltageby the voltage based arbitration scheme.

For example, some recent semiconductor devices (e.g., low-power doubledata rate synchronous DRAM), such as Low Power Double Data Rate 4(LPDDR4), adopted a time based arbitration scheme. Under the time basedarbitration scheme, each chip sharing a ZQ resistor is programmed with aunique time delay to create a master-slave hierarchy. This time basedarbitration scheme enables any number of chips in the semiconductormemory device per package to use the ZQ resistor, although the requiredtime increases exponentially according to the number of chips. Forexample, the semiconductor memory device including 16 chips sharing asingle ZQ resistor may need 16 different delay variations for the 16chips.

Thus, an arbitration circuit implementing an arbitration scheme isneeded for a semiconductor memory device having a larger number of chipsto complete the ZQ calibration without extending time for ZQ calibrationrequest arbitration.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic block diagram of a semiconductor memory deviceincluding a plurality of chips, in accordance with an embodiment of thepresent disclosure.

FIG. 2 is a schematic block diagram of a chip of the semiconductormemory device, in accordance with an embodiment of the presentdisclosure.

FIG. 3 is a circuit diagram of a ZQ calibration circuit in accordancewith an embodiment of the present disclosure.

FIG. 4A is a flow diagram of a ZQ calibration arbitration in accordancewith an embodiment of the present disclosure.

FIG. 4B is a timing diagram of an arbitration clock and a ZQ pad voltagein the ZQ calibration arbitration in accordance with an embodiment ofthe present disclosure.

FIG. 5 is a schematic diagram of an arbiter circuit in the ZQcalibration circuit in accordance with an embodiment of the presentdisclosure.

FIG. 6A is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure.

FIG. 6B is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure.

FIG. 6C is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure.

FIG. 7A is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure.

FIG. 7B is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure.

FIG. 7C is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure.

FIG. 7D is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure.

FIG. 7E is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure.

FIG. 8A is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure.

FIG. 8B is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure.

FIG. 9A is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure.

FIG. 9B is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure.

FIG. 10A is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure.

FIG. 10B is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Various embodiments of the present disclosure will be explained below indetail with reference to the accompanying drawings. The followingdetailed description refers to the accompanying drawings that show, byway of illustration, specific aspects and embodiments in which thepresent invention may be practiced. These embodiments are described insufficient detail to enable those skilled in the art to practice thepresent invention. Other embodiments may be utilized, and structural,logical and electrical changes may be made without departing from thescope of the present invention. The various embodiments disclosed hereinare not necessary mutually exclusive, as some disclosed embodiments canbe combined with one or more other disclosed embodiments to form newembodiments.

FIG. 1 is a schematic block diagram of a semiconductor memory device 100including a plurality of chips 135, 140, 145 and 150, in accordance withan embodiment of the present disclosure. The semiconductor memory device100 may include a controller 105, a command/address bus 110, respectiveI/O buses IO_A 115, IO_B 120, IO_C 125, and IO_D 130, chip A 135, chip B140, chip C 145, chip D 150, and a ZQ resistor 155. For example, thesemiconductor memory device 100 may be packaged in a multi-chip package(MCP) or a package on packages (POP). In the following embodiments, theterms chip and die may be used interchangeably. In some embodiments, thecontroller 105 may be a memory controller. The controller 105 may beimplemented as part of the same chip, a separate chip, or integratedinto another chip, such as a microprocessor. The controller 105 may becoupled to each of the chips 135, 140, 145, and 150, via acommand/address bus 110. The controller 105 may further be coupled toeach of the chips 135, 140, 145, and 150, respectively, via respectiveI/O buses 115, 120, 125 and 130. Each of the chips 135, 140, 145 and 150may then have their calibration terminals coupled to the ZQ resistor155. Accordingly, the ZQ resistor 155 may be shared among the chips 135,140, 145 and 150. For example, each of the chips 135, 140, 145 and 150may individually be a memory device, including, without limitation, NANDflash memory, dynamic random access memory (DRAM) and synchronous DRAM(SDRAM). Alternatively, each of the chip may be a semiconductor device,such as a controller (e.g., the controller 105).

In these embodiments, because the ZQ resistor 155 is shared among thechips 135, 140, 145 and 150 and the command/address bus 110 coupled tothe controller 105 may also be shared among the chips 135, 140, 145 and150, each of the chips 135, 140, 145 and 150 may be configured toreceive commands concurrently, including ZQ calibration commands. Aspreviously discussed, ZQ calibration operations may not typically beperformed simultaneously among the chips 135, 140, 145 and 150, soarbitration is required to determine the order in which the chips 135,140, 145 and 150, requesting ZQ calibration, may perform a ZQcalibration operation. Accordingly, arbiter circuits may be provided tocontrol ZQ calibration operations. Although in FIG. 1 thecommand/address bus 110 is shared, this should not be taken as alimiting example. Thus, in other embodiments, the command/address bus110 may include respective lines to the chips 135, 140, 145 and 150 fromthe controller 105.

FIG. 2 is a schematic block diagram of a chip 235 of the semiconductormemory device 200, in accordance with an embodiment of the presentdisclosure. For example, the semiconductor memory device 200 may includea ZQ resistor (RZQ) 255 and a plurality of chips, including the chip235. For example, the semiconductor memory device 200 including the chip235 and the ZQ resistor (RZQ) 255 may be used as the semiconductormemory device 100 including the chip 135 the ZQ resistor 155 previouslydescribed regarding FIG. 1.

For example, the chip 235 may include a clock input circuit 205, aninternal clock generator 207, a timing generator 209, an address commandinput circuit 215, an address decoder 220, a command decoder 225, aplurality of row decoders 230, a memory cell array 245 including senseamplifiers 250 and transfer gates 295, a plurality of column decoders240, a plurality of read/write amplifiers 265, an input/output (I/O)circuit 270, the ZQ resistor (RZQ) 255, a ZQ calibration circuit 275,and a voltage generator 290. The semiconductor memory device 200 mayinclude a plurality of external terminals including address and commandterminals coupled to command/address bus 210, clock terminals CK and/CK, data terminals DQ, DQS, and DM, power supply terminals VDD, VSS,VDDQ, and VSSQ, and a calibration terminal ZQ. The chip 235 may bemounted on a substrate 260, for example, a memory module substrate, amother board or the like.

The memory cell array 245 includes a plurality of banks, each bankincluding a plurality of word lines WL, a plurality of bit lines BL, anda plurality of memory cells MC arranged at intersections of theplurality of word lines WL and the plurality of bit lines BL. Theselection of the word line WL for each bank is performed by acorresponding row decoder 230 and the selection of the bit line BL isperformed by a corresponding column decoder 240. The plurality of senseamplifiers 250 are located for their corresponding bit lines BL andcoupled to at least one respective local I/O line further coupled to arespective one of at least two main I/O line pairs, via transfer gatesTG 295, which function as switches.

The address/command input circuit 215 may receive an address signal anda bank address signal from outside at the command/address terminals viathe command/address bus 210 and transmit the address signal and the bankaddress signal to the address decoder 220. The address decoder 220 maydecode the address signal received from the address/command inputcircuit 215 and provide a row address signal XADD to the row decoder230, and a column address signal YADD to the column decoder 240. Theaddress decoder 220 may also receive the bank address signal and providethe bank address signal BADD to the row decoder 230 and the columndecoder 240.

The address/command input circuit 215 may receive a command signal fromoutside, such as, for example, a memory controller 105 at thecommand/address terminals via the command/address bus 210 and providethe command signal to the command decoder 225. The command decoder 225may decode the command signal and provide generate various internalcommand signals. For example, the internal command signals may include arow command signal to select a word line, a column command signal, suchas a read command or a write command, to select a bit line, and a ZQcalibration command that may activate the ZQ calibration circuit 275.

Accordingly, when a read command is issued and a row address and acolumn address are timely supplied with the read command, read data isread from a memory cell in the memory cell array 245 designated by therow address and the column address. The read/write amplifiers 265 mayreceive the read data DQ and provide the read data DQ to the IO circuit270. The JO circuit 270 may provide the read data DQ to outside via thedata terminals DQ, DQS and DM together with a data strobe signal at DQSand a data mask signal at DM. Similarly, when the write command isissued and a row address and a column address are timely supplied withthe write command, and then the input/output circuit 270 may receivewrite data at the data terminals DQ, DQS, DM, together with a datastrobe signal at DQS and a data mask signal at DM and provide the writedata via the read/write amplifiers 265 to the memory cell array 245.Thus, the write data may be written in the memory cell designated by therow address and the column address.

Turning to the explanation of the external terminals included in thesemiconductor device 200, the clock terminals CK and /CK may receive anexternal clock signal and a complementary external clock signal,respectively. The, external clock signals (including complementaryexternal clock signal) may be supplied to a clock input circuit 205. Theclock input circuit 205 may receive the external clock signals andgenerate an internal clock signal ICLK. The clock input circuit 205 mayprovide the internal clock signal ICLK to an internal clock generator207. The internal clock generator 207 may generate a phase controlledinternal clock signal LCLK based on the received internal clock signalICLK and a clock enable signal CKE from the address/command inputcircuit 215. Although not limited thereto, a DLL circuit may be used asthe internal clock generator 207. The internal clock generator 207 mayprovide the phase controlled internal clock signal LCLK to the IOcircuit 270 and a timing generator 209. The IO circuit 270 may use thephase controller internal clock signal LCLK as a timing signal fordetermining an output timing of read data. The timing generator 209 mayreceive the internal clock signal ICLK and generate various internalclock signals.

The power supply terminals may receive power supply voltages VDD andVSS. These power supply voltages VDD and VSS may be supplied to avoltage generator circuit 290. The voltage generator circuit 290 maygenerate various internal voltages, VPP, VOD, VARY, VPERI, and the likebased on the power supply voltages VDD and VSS. The internal voltage VPPis mainly used in the row decoder 230, the internal voltages VOD andVARY are mainly used in the sense amplifiers 250 included in the memorycell array 245, and the internal voltage VPERI is used in many othercircuit blocks. The power supply terminals may also receive power supplyvoltages VDDQ and VSSQ. The 10 circuit 270 may receive the power supplyvoltages VDDQ and VSSQ. For example, the power supply voltages VDDQ andVSSQ may be the same voltages as the power supply voltages VDD and VSS,respectively. However, the dedicated power supply voltages VDDQ and VSSQmay be used for the IO circuit 270 and the ZQ calibration circuit 275.

The calibration terminal ZQ of the semiconductor memory device 200 maybe coupled to the ZQ calibration circuit 275. The ZQ calibration circuit275 may perform a calibration operation with reference to an impedanceof the ZQ resistor (RZQ) 255. For example, the ZQ resistor (RZQ) 255 maybe mounted on the substrate 260 that is coupled to the calibrationterminal ZQ. For example, the ZQ resistor (RZQ) 255 may be coupled to apower supply voltage (VDDQ). An impedance code ZQCODE obtained by thecalibration operation may be provided to the IO circuit 270, and thus animpedance of an output buffer (not shown) included in the IO circuit 270is specified.

FIG. 3 is a circuit diagram of a ZQ calibration circuit 375 inaccordance with an embodiment of the present disclosure. For example,each chip of the plurality of chips 335, 340, 345 and 350 may includethe ZQ calibration circuit 375 and a calibration terminal ZQ (e.g., ZQpad) 336. For example, the ZQ calibration circuit 375 may include anarbiter circuit 380. The arbiter circuit 380 may be activated responsiveto an activation of a chip (e.g., power on, etc.). For example, thearbiter circuit 380 may provide a pull-down (PDN) code signal. The ZQcalibration circuit 375 may include a combination of a data terminal(DQ) pull-up (PUP) driver circuit 382 and a data terminal (DQ) pull-down(PDN) driver circuit 383 and a data terminal (DQ) pull-down (PDN) drivercircuit 384 for arbitration as well as calibration, that are replicacircuits of a data terminal (DQ) pull-up (PUP) driver circuit, a dataterminal (DQ) pull-down (PDN) driver circuit and a data terminal (DQ)pull-down (PDN) driver circuit attached to actual data terminals DQ. TheDQ PDN driver circuit 384 may receive the PDN code signal from thearbiter circuit 380, and may pull down a ZQ pad voltage (VZQ) at thecalibration terminal ZQ 336 responsive to the PDN code signal. The ZQpad voltage (VZQ) may be provided to a switch 385 (e.g., multiplexerMux). The combination of the DQ PUP driver circuit 382 and the DQ PDNdriver circuit 383 may execute adjustment of an intermediate ZQ voltage(iVZQ) at an intermediate node 388 between the combination of the DQ PUPdriver circuit 382 and the DQ PDN driver circuit 383. For example, theDQ PUP driver circuit 382 may include a plurality of transistors coupledin parallel between a power supply terminal VDDQ and the intermediatenode 388. The DQ PDN driver circuit 383 may include a plurality oftransistors coupled in parallel between a power supply terminal VSSQ andthe intermediate node 388. The intermediate ZQ voltage (iVZQ) may beprovided to the switch 385. The switch 385 may provide either the ZQ padvoltage VZQ or the intermediate ZQ voltage iVZQ, depending on whetherthe ZQ calibration circuit 375 is executing arbitration or ZQcalibration, respectively. For example, the ZQ calibration circuit 375may include a comparator 386. The comparator 386 may compare either theZQ pad voltage VZQ or the intermediate ZQ voltage iVZQ provided by theswitch 385 with a ZQ reference voltage ZQVREF or a ZQ arbitrationreference voltage provided by a reference voltage generator 390. Forexample, the reference voltage generator 390 may be included in the ZQcalibration circuit 375, or the voltage generator 290 in FIG. 2 mayprovide the ZQ reference voltage ZQVREF and the ZQ arbitration referencevoltage instead. For example, the comparator 386 may determine whetherthe ZQ pad voltage (VZQ) has been controlled by another requesting chipor the ZQ resistor RZQ 255 is currently in use.

The comparator 386 may provide a comparator result signal to the arbitercircuit 380 and a ZQ calibration code control circuit 381. For example,the arbiter circuit 380 may provide ZQ pad voltage control via the DQPDN driver circuit 384 according to a ZQ timing pattern unique to thechip, having a fixed duration common to the plurality of chips. Thearbiter circuit 380 may provide the PDN code until the ZQ pad voltage(VZQ) at the calibration terminal ZQ 336 using the ZQ arbitrationreference voltage, which may be different from the ZQ reference voltageZQVREF. The ZQ timing pattern is unique for each chip, in order todetermine whether the requesting chip should gain access to a ZQresistor RZQ 355. The ZQ timing pattern may be programmed, or otherwisestored for each chip. For example, the arbiter circuit 380 for the chip335 may include a register (not shown) for the chip 335 that may beprogrammed with the ZQ timing pattern information specific to the chip335 for a duration common to the chips. Thus, each arbiter circuit 380for each respective chip may be configured to store the ZQ timingpattern information of a duration that is different from ZQ timingpattern information having the same duration, stored on the registers ofthe other chips. For example, the timing pattern information may beunique to an individual chip among a plurality of chips of thesemiconductor memory device 200. The register may include, withoutlimitation, programmable fuses, anti-fuses, a mode register, or othersuitable components. Thus, the priority of a chip may be, set orprogrammed via the register. The ZQ calibration code control circuit 381may be included in the ZQ calibration circuit 375. The ZQ calibrationcode control circuit 381 may provide a PUP code and a PDN code to the DQPUP driver circuit 382 and the DQ PDN driver circuit 383 respectively,responsive to the comparator result signal until the intermediate ZQvoltage iVZQ at the intermediate node 388 may match the ZQ referencevoltage ZQVREF.

FIG. 4A is a flow diagram of a ZQ calibration arbitration in accordancewith an embodiment of the present disclosure. FIG. 4B is a timingdiagram of an arbitration clock and a ZQ pad voltage VZQ in the ZQcalibration arbitration in accordance with the embodiment of the presentdisclosure. For example, the ZQ calibration may start with a fixedlength time-based arbitration (S400). Each chip may provide a requestfor the ZQ calibration using a ZQ resistor (e.g., the ZQ resistor 255,355). The first step (Step 1, S401) of the fixed length time-basedarbitration is header detection. For example, an initial state of thefixed length time-based arbitration may be that the ZQ pad voltage beingset to a float high state (e.g., disabling the DQ PDN driver circuit384) to provide a header. For example, the header may be signaled by theZQ pad voltage VZQ being maintained at a logic high level for threeclock cycles. The ZQ pad voltage VZQ may be compared (e.g., by thecomparator 386) with a ZQ arbitration reference voltage at an end ofeach clock cycle of three clock cycles. For example, the ZQ arbitrationreference voltage may be in-between a pull-down voltage range (e.g.,substantially 0V) signaling a logic low state and the power supplyvoltage VDDQ signaling the logic high state. Because the ZQ resistor maybe coupled to the power supply voltage VDDQ (or VSS) and the header isat the logic high state (or a logic low state), another chip may beexecuting either the ZQ calibration arbitration process or the ZQcalibration process, if the ZQ pad voltage VZQ is in the pull-downvoltage range, lower than the ZQ arbitration reference voltage. Thus,the current request fails and repeats Step 1 of the ZQ arbitration tore-request the ZQ calibration. If the ZQ pad voltage VZQ is higher thanthe ZQ arbitration reference voltage during Step 1, the request mayproceed to the second step. The second step may include pulling down theZQ pad voltage for a certain period (Step 2, S402) to signal that the ZQcalibration is being requested to the other chip. For example, theduration of this pulling down may be two clock cycles, or other clockcycles, without limitation.

The third step (Step 3, S403) of the fixed length time-based arbitrationmay include a binary coding and detection. For each chip, a die numberthat may be a binary code unique to each chip may be assigned andsignaled as a unique ZQ timing pattern. The die number may be used todetermine chip priority. The ZQ pad voltage VZQ may be compared (e.g.,by the comparator 386) with a ZQ arbitration reference voltage at an endof each clock cycle of a fixed duration of the ZQ timing pattern commonto the chips. For each chip, pulling down the ZQ pad voltage VZQ may bedisabled for one clock cycle if a bit in the die number for the currentchip is high. Because the ZQ resistor may be coupled to the power supplyvoltage VDDQ (or VSS) and the die number for the current chipcorresponds to the logic high state (or a logic low state), another chipmay be executing either the ZQ calibration arbitration process withpriority or the ZQ calibration, if the ZQ pad voltage VZQ is in thepull-down voltage range (or in the pull-up voltage range). Thus, thecurrent request fails and repeats Step 1 of the ZQ arbitration tore-request the ZQ calibration. For example, increasing the minimum clockcycles of the logic low state between the two logic high states mayimprove detection of the comparator's comparator result. After Step 3(S403), the request may include the fourth step of pulling down the ZQpad voltage for a certain period (Step 4, S405) to signal that the ZQcalibration is being requested to the other chip. For example, theduration of this pulling down may be two clock cycles, or other clockcycles, without limitation.

The fifth step (Step 5, S405) of the fixed length time-based arbitrationmay include a stop bit detection. For each chip, a common stop bit of afixed duration (e.g., one clock cycle) of the ZQ timing pattern commonto the chips may be signaled by disabling pulling down the ZQ padvoltage VZQ for the fixed duration (e.g., one clock cycle) correspondingto the stop bit. The ZQ pad voltage VZQ may be compared (e.g., by thecomparator 386) with a ZQ, arbitration reference voltage at an end ofthe fixed duration (e.g., one clock cycle) signaling the stop bit. TheZQ resistor may be coupled to the power supply voltage VDDQ and the ZQpad voltage VZQ corresponds to the stop bit is supposed to be at thelogic high state. Thus, the arbitration passes and ZQ calibrationprocess for the current chip may be initiated, if the ZQ pad voltage VZQis at the logic high state (e.g., in the pull-up voltage range). Anotherchip may be executing either the ZQ calibration arbitration processorthe ZQ calibration process, if the ZQ pad voltage VZQ is in thepull-down voltage range, and the current request fails and repeats Step1 of the next ZQ arbitration to re-request the ZQ calibration.

FIG. 5 is a schematic diagram of an arbiter circuit 50 in the ZQcalibration circuit in accordance with an embodiment of the presentdisclosure. For example, the arbiter circuit 50 may be the arbitercircuit 380 in FIG. 3. The arbiter circuit 50 may include a set of fusesindicating a set of die number <3:0> signals (e.g., the die number inStep 3 S403 of FIGS. 4A and 4B) of a current chip (die) among aplurality of chips among in a semiconductor memory device. For example,the arbiter circuit 50 may include buffers 500, 501, 502 and 503 thatmay receive and provide the die number <0>, the die number <1>, the dienumber <2> and the die number <3> respectively in Step 3 (S403). Thearbiter circuit 50 may include output terminals 510, 511, 512 and 513.The output terminal 510 may provide the die number <0> signal as a firstbit (bit 0) of the ZQ timing pattern in Step 3. The output terminal 511may provide the die number <1> signal as a second bit (bit 1) of the ZQtiming pattern in Step 3. The output terminal 512 may provide the dienumber <2> signal as a third bit (bit 2) of the ZQ timing pattern inStep 3. The output terminal 513 may provide the die number <3> signal asa fourth bit (bit 3) of the ZQ timing pattern in Step 3.

The arbiter circuit 50 may also include a logic circuit 504 (e.g., a NORcircuit) and an output terminal 514. The logic circuit 504 may receivethe die number <0>-<3> signals and provide an active state signal (e.g.,at a logic high level) when a chip having all the die number <0>-<3>signals are inactive (e.g., a logic low level) is requesting for the ZQcalibration in Step 3 (S403). The output terminal 514 may provide theactive state signal as a fifth bit (bit 4) of the ZQ timing pattern inStep 3 to indicate if the chip having all the die number <0>-<3> signalsis requesting for the ZQ calibration.

FIG. 6A is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure. For example, the plurality of chips may includeDie0, Die1, Die2 and Die3. In fixed length time-based arbitration, eachchip, Die0, Die1, Die2 and Die3 may provide a request for the ZQcalibration using a ZQ resistor (e.g., the ZQ resistor 255, 355). Thefirst step of the fixed length time-based arbitration is the headerdetection (e.g., Step 1, S401 in FIG. 4A) that may be executed by the ZQpad voltage control by setting the ZQ pad voltage to a float high state(e.g., by disabling the DQ PDN driver circuit 384) to provide a header.For example, the header may be signaled for three clock cycles from T0,which is common for any chip of the plurality of chips, Die0, Die1, Die2and Die3. Each chip requesting the ZQ calibration may compare the ZQ padvoltage VZQ (e.g., by the comparator 386) with a ZQ arbitrationreference voltage in-between the pull-down voltage range and the powersupply voltage VDDQ at an end of each clock cycle at T1, T2 and T3during Step 1 (S401). Because the ZQ resistor may be coupled to thepower supply voltage VDDQ and the ZQ pad voltage control any chiprequesting ZQ calibration pulls up the ZQ pad voltage to the logic highstate, another chip may be executing either the ZQ calibrationarbitration process or the ZQ calibration process, if the ZQ pad voltageVZQ is in the pull-down voltage range, lower than the ZQ arbitrationreference voltage. Thus, the current request fails and repeats the ZQarbitration to re-request the ZQ calibration. If the ZQ pad voltage VZQis higher than the ZQ arbitration reference voltage for each clock cycleof Step 1 (S401), the fixed length time-based arbitration may proceed toa second step (Step 2, S402). The second step, pulling down the ZQ padvoltage for a certain period (Step 2, S402) following. Step 1 may beexecuted to signal that the ZQ calibration is being requested to theother chip. For example, the duration of this pulling down may be twoclock cycles from T3 to T5 as shown in FIG. 6A. Alternatively otherclock cycles, without limitation may be used for Step 2.

The third step (Step 3, S403) of the fixed length time-based arbitrationmay include a binary coding and detection, from T5 to T12 as shown inFIG. 6A. For each chip, a die number that may be a binary code unique toeach chip may be assigned and signaled as a unique ZQ timing pattern.The die number may be used to determine chip priority. For each chip,pulling down the ZQ pad voltage VZQ may be disabled for one clock cycleif a bit in the die number for the current chip is high. For example,Die0 may have a die number “001”, and pulling down the ZQ pad voltageVZQ may be disabled for a clock cycle from T11 to T12 corresponding tothe third bit “1” in “001”. Die1 may have a die number “010”, andpulling down the ZQ pad voltage VZQ may be disabled for a clock cyclefrom T8 to T9 corresponding to the second bit “1” in “010”. Die2 mayhave a die number “011”, and pulling down the ZQ pad voltage VZQ may bedisabled for a clock cycle from T8 to T9 corresponding to the second bit“1” in “011” and a clock cycle from T11 to T12 corresponding to thethird bit “1” in “011”. Die3 may have a die number “100”, and pullingdown the ZQ pad voltage VZQ may be disabled for a clock cycle from T5 toT6 corresponding to the first bit “1” in “100”. The ZQ pad voltage VZQmay be compared (e.g., by the comparator 386) with a ZQ arbitrationreference voltage at an end of each clock cycle of a fixed duration ofthe ZQ timing pattern common to the chips. Another chip may be executingeither the ZQ calibration arbitration process with priority or the ZQcalibration, if the ZQ pad voltage VZQ is in the pull-down voltagerange, thus the current request fails and repeats Step 1 of the ZQarbitration to re-request the ZQ calibration. After Step 3 (S403) iscomplete, the request may proceed to the fourth step of pulling down theZQ pad voltage for a certain period (Step 4, S405) to signal that the ZQcalibration is being requested to the other chip. For example, theduration of this pulling down may be two clock cycles (e.g., 112 to T14in FIG. 6A), or other clock cycles, without limitation.

The fifth step (Step 5, S405) of the fixed length time-based arbitrationmay include a stop bit detection. For each chip, a common stop bit of afixed duration (e.g., from T14 to T15 in FIG. 6A) of the ZQ timingpattern common to the chips may be signaled by disabling pulling downthe ZQ pad voltage VZQ during Step 5. The ZQ pad voltage VZQ may becompared (e.g., by the comparator 386) with a ZQ arbitration referencevoltage at an end of the fixed duration (e.g., T15 in FIG. 6A) signalingthe stop bit. Thus, the arbitration passes and ZQ calibration processfor the current chip may be initiated, if the ZQ pad voltage VZQ is atthe logic high state (e.g., in the pull-up voltage range). Another chipmay be executing either the ZQ calibration arbitration process or the ZQcalibration process, if the ZQ pad voltage VZQ is in the pull-downvoltage range, and the current request fails and repeats Step 1 of theZQ arbitration to re-request the ZQ calibration.

FIG. 6B is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure. Description of components and stepscorresponding to components and steps (Steps 1, 2, 4 and 5) included inand previously described with reference to FIG. 6A will not be repeated.The third step (Step 3, S403) of the fixed length time-based arbitrationmay include another binary coding and detection, from T5 to T12 as shownin FIG. 6B. For example, Die0 may have a die number “100” and otherchips Die1 to Die3 may have die numbers “001” to “011” that may bedirectly binary coded from a die identifier “1” to “3”.

FIG. 6C is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure. Description of components and stepscorresponding to components and steps (Steps 1, 2, 4 and 5) included inand previously described with reference to FIG. 6A will not be repeated.The third step (Step 3, S403) of the fixed length time-based arbitrationmay include another binary coding and detection, from T5 to T21 as shownin FIG. 6C. The die number binary coded for each chip may be mirrored inthe timing diagram of FIG. 6C to be symmetrical with respect to thecenter of the ZQ timing pattern (e.g., in a time domain) during Step 3.For example, Die0 may have a die number “001100”, Die1 may have a dienumber binary codes “010010”.Die2 may have a die number “011110”. Die3may have a die number “100001”. The mirrored ZQ timing pattern may bemore resistant to aliasing with large oscillator variation.

FIG. 7A is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure. Description of components and stepscorresponding to components and steps included in and previouslydescribed with reference to FIGS. 6A-6C will not be repeated. If a clockcycle of one chip (e.g., Die B) in the plurality of chips is longer thana clock cycle of another chip (e.g., Die A) in the plurality of chipsand a pulse width in a logic high state to signal a stop bit in Step 5of the one chip (Die B) may be longer than a period between a first andthird strobes in Step 1 of the other chip (Die A). Thus, the other chip(Die A) may fail to detect that the one chip (Die B) is proceeding to ZQcalibration. In order to prevent such failure, a pulse width in a floatstate of the one chip (Die B) may be configured shorter than two clockcycles of the other chip (Die A) as expressed in an inequality below.

FPW_(DieB)<2T_(DieA) . . . (Inequality 1)

FIG. 7B is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure. Description of components and stepscorresponding to components and steps included in and previouslydescribed with reference to FIGS. 6A-6C will not be repeated. If a pulsewidth of a last bit in Step 3 in a logic high state of one chip (e.g.,Die B) is longer than a clock cycle of another chip (e.g., Die A), andthe last bit is followed by the stop bit, the pulse width of the lastbit in Step 3 of the one chip (Die B) may still overlaps the first andsecond strobes of Step 1 in the other chip (Die A) and the stop bit inStep 5 of the one chip (Die B) may coincide with the third strobe ofStep 1 in the other chip (Die A). Thus, the other chip (Die A) may failto detect that the one chip (Die B) is proceeding to ZQ calibration. Inorder to prevent such failure, duration of pulling-down the ZQ padvoltage in Step 2 and Step 4 may be configured to be longer than twoclock cycles and the pulse width in a float high state in Step 3 andStep 5 may be configured to be shorter than one clock cycle.

FIG. 7C is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure. Description of components and stepscorresponding to components and steps included in and previouslydescribed with reference to FIGS. 6A-6C will not be repeated. If a clockcycle of one chip (e.g., Die B) in the plurality of chips is three clockcycles of another chip (e.g., Die A) or longer in the plurality ofchips, a pulse width corresponding to a third bit of a die number“00100” for the other chip (Die A) in Step 3 in a logic high state maycoincide with a first bit of a die number “11xxx (x: don't care)” of theone chip (Die B) in Step 3 and a stop bit for the other chip (Die A) inStep 5 may coincide with a second bit of the die number of the one chip(Die B). Thus, the one chip (Die B) may fail to detect that the otherchip (Die A) is proceeding to ZQ calibration. In order to prevent suchfailure, a clock cycle difference between chips may be configured to belimited to within ±33%.

FIG. 7D is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure. Description of components and stepscorresponding to components and steps included in and previouslydescribed with reference to FIGS. 6A-6C will not be repeated. Assumingthat a clock cycle of one chip (e.g., Die B) in the plurality of chipsis about one and half clock cycles of another chip (e.g., Die A) orlonger in the plurality of chips, a pulse width corresponding to a thirdbit of a die number “00100” for the other chip (Die A) in Step 3 in alogic high state may coincide with a second bit of a die number “0101x(x: don't care)” of the one chip (Die B) in Step 3 and a stop bit forthe other chip (Die A) in Step 5 may coincide with a fourth bit of thedie number of the one chip (Die B). Thus, the one chip (Die B) may failto detect that the other chip (Die A) is proceeding to ZQ calibration.In order to prevent such failure, a die number “00100” may be classifiedas illegal and prohibited to use (e.g., instead, use a die number“10100”). Logic levels of signals, particularly a binary coded dienumber used and/or prohibited in the embodiments described the above aremerely examples and not limited to those specifically described in theabove.

FIG. 7E is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure. Description of components and stepscorresponding to components and steps included in and previouslydescribed with reference to FIGS. 6A-6C will not be repeated. If a clockcycle of one chip (e.g., Die B) in the plurality of chips is two clockcycles of another chip (e.g., Die A) or longer in the plurality ofchips, a pulse width corresponding to a second bit, a fourth bit of adie number “01010” for the other chip (Die A) in Step 3 in a logic highstate and a stop bit in Step 5 may coincide with first to third bits ofa die number “111xx (x: don't care)” of the one chip (Die B) in Step 3,respectively. Thus, the one chip (Die B) may fail to detect that theother chip (Die A) is proceeding to ZQ calibration. This scenario may beprevented, if a clock cycle difference between chips may be configuredto be limited to within ±33% as described above referring to FIG. 7C.

FIG. 8A is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure. Description of components and stepscorresponding to components included in and previously described withreference to FIGS. 6A-6C will not be repeated. A first step oftime-based arbitration is header detection (e.g., Float and Hi-Detect inFIG. 8A). For example, the header may be signaled by the ZQ pad voltageVZQ at a logic high level for three clock cycles. If the ZQ pad voltageVZQ is higher than the ZQ arbitration reference voltage during theheader detection, the request may proceed to a second step of pullingdown the ZQ pad voltage for a certain period (e.g., Oscillator AlignmentPull-down in FIG. 8A) to signal that the ZQ calibration is beingrequested to the other chip. For example, the duration of this pullingdown may be nine clock cycles, or other clock cycles, withoutlimitation. A third step (e.g., Sync Detect in FIG. 8A) of thetime-based arbitration may include a sync bit detection. For each chip,a common sync bit of a fixed duration (e.g., one clock cycle) of the ZQtiming pattern common to the chips may be signaled by disabling pullingdown the ZQ pad voltage VZQ for the fixed duration (e.g., one clockcycle) corresponding to the sync bit. Once the sync bit is detected, afourth step of the time-based arbitration may include a ZQ calibrationrequest detection (e.g., Staggered Requests in FIG. 8A). For each chip,a pulse with a same width and a delay unique to the chip may be assignedand signaled as a unique ZQ timing pattern. For example, the delay maybe longer, if a priority of ZQ calibration to the chip is higher. If theZQ pad voltage VZQ is higher than the ZQ arbitration reference voltageduring the pulse, the request may proceed to the ZQ calibration.

FIG. 8B is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure. Description of components and stepscorresponding to components included in and previously described withreference to FIGS. 6A-6C and 8A will not be repeated. For example,timings (e.g., phases) of the first step including three clock cyclesmay differ for the plurality of chips. For example, the first step ofDie1 may have a delay of a half clock cycle from the first step of Die0that may have a delay of a half clock cycle from the first steps of Die2and Die3. For example, durations of the second step including threeclock cycles may differ for the plurality of chips due to differentclock cycles of oscillators (e.g., oscillator 307 in FIG. 3) for theplurality of chips, in addition to different timings of the second stepfor the plurality of chips. For example, Die2 and Die3 may enter thesecond step at the same time, however, Die2 may proceed to the thirdstep earlier than Die3 proceeds (e.g., three clock cycles before basedon a clock signal CLK, as shown in FIG. 8B).

FIG. 9A is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure. Description of components and stepscorresponding to components included in and previously described withreference to FIGS. 6A-6C will not be repeated. For example, the ZQcalibration may start with a fixed length time-based arbitration. Afirst step of the fixed length time-based arbitration is headerdetection (e.g., Float and Hi-Detect in FIG. 9A). For example, theheader may be signaled by the ZQ pad voltage VZQ at a logic high levelfor three clock cycles. If the ZQ pad voltage VZQ is higher than the ZQarbitration reference voltage during the header detection, the requestmay proceed to a second step of the fixed length time-based arbitrationmay include a ZQ calibration request detection (e.g., First Detect inFIG. 9A). For each chip, a pulse with a same width and a delay unique tothe chip may be assigned and signaled in a same duration of the secondstep as a unique ZQ timing pattern. For example, the delay may belonger, if a priority of ZQ calibration to the chip is higher. If the ZQpad voltage VZQ is lower than the ZQ arbitration reference voltageduring the pulse, the request may fail and repeats Step 1 of the ZQarbitration to re-request the ZQ calibration. After the second step, athird step (e.g., Sync and Requests Detect in FIG. 9A) of the fixedlength time-based arbitration may be executed. For each chip, a commonrequest period for a plurality of clock cycles (e.g., six clock cyclesin a logic low state in FIG. 9A) by pulling-down the ZQ pad voltage VZQfollowed by a common sync bit by disabling pulling down the ZQ padvoltage VZQ for a fixed duration (e.g., one clock cycle) may besignaled. The arbitration passes and ZQ calibration process for thecurrent chip may be initiated, once the sync bit is detected bydetecting the ZQ pad voltage VZQ at the logic high state (e.g., in thepull-up voltage range). Another chip may be executing either the ZQcalibration arbitration process or the ZQ calibration process, if the ZQpad voltage VZQ is in the pull-down voltage range, and the currentrequest fails and repeats Step 1 of the ZQ arbitration to re-request theZQ calibration.

FIG. 9B is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure. Description of components and stepscorresponding to components included in and previously described withreference to FIGS. 6A-6C, 8B and 9A will not be repeated. For example,timings (e.g., phases) of the first step including three clock cyclesmay differ for the plurality of chips. For example, the first step ofDie1 may have a delay of a half clock cycle from the first step of Die0that may have a delay of a half clock cycle from the first steps of Die2and Die3. For each chip, a pulse with a same number of clock cycle (oneclock cycle) and a delay (e.g., a unique number of clock cycles) may beassigned and signaled in a same number of clock cycles for each chip ofthe second step as a unique ZQ timing pattern. For example, durations ofthe second step including the pulse may differ for the plurality ofchips due to different clock cycles for the plurality of chips in a samenumber of clock cycles of the second step, in addition to differenttimings of the second step for the plurality of chips. After the secondstep, a third step (e.g., Sync and Requests Detect in FIG. 9A) of thefixed length time-based arbitration may be executed. For example, Die2and Die3 may enter the second step at the same time, however, Die2 mayproceed to the sync bit of the third step earlier than Die3 proceeds(e.g., six clock cycles before, as shown in FIG. 8B), due to differentclock cycles of oscillators (e.g., oscillator 307 in FIG. 3) for theplurality of chips.

FIG. 10A is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure. Description of components and stepscorresponding to components included in and previously described withreference to FIGS. 6A-6C and 9A will not be repeated. In the secondstep, unlike including one pulse in FIG. 9A, the ZQ timing patternincludes two pulses. Similarly to FIG. 6C, the die number linear codedfor each chip may be mirrored in the timing diagram of FIG. 10A to besymmetrical with respect to the center of the second step of the ZQtiming pattern. Thus the first pulse is included in a first period(e.g., First Detect in FIG. 10A) and the second pulse is included in asecond period (e.g., Final Request Detect in FIG. 10A) in the secondstep. The mirrored ZQ timing pattern in FIG. 10A may be more resistantto aliasing with large oscillator variation.

FIG. 10B is a timing diagram of a plurality of arbitration signalpatterns for a plurality of chips in accordance with an embodiment ofthe present disclosure. Description of components and stepscorresponding to components included in and previously described withreference to FIGS. 6A-6C, 8B and 10A will not be repeated. For example,timings (e.g., phases) of the first step including three clock cyclesmay differ for the plurality of chips. For each chip, two pulses with asame number of clock cycle (one clock cycle) and a delay (e.g., a uniquenumber of clock cycles) mirrored in the timing diagram of FIG. 10B to besymmetrical with respect to the center of the second step of the ZQtiming pattern may be assigned and signaled in a same number of clockcycles for each chip of the second step as a unique ZQ timing pattern.For example, durations of the second step including the pulses maydiffer for the plurality of chips due to different clock cycles for theplurality of chips in a same number of clock cycles of the second step,in addition to different timings of the second step for the plurality ofchips. For example, Die2 and Die3 may enter the second step at the sametime, however, Die2 may proceed to the ZQ calibration earlier than Die3proceeds, due to different clock cycles of oscillators (e.g., oscillator307 in FIG. 3) for the plurality of chips. The mirrored ZQ timingpattern may be more resistant to aliasing with large oscillatorvariation.

Logic levels of signals used in the embodiments described the above aremerely examples. However, in other embodiments, combinations of thelogic levels of signals other than those specifically described in thepresent disclosure may be used without departing from the scope of thepresent disclosure.

Although this invention has been disclosed in the context of certainpreferred embodiments and examples, it will be understood by thoseskilled in the art that the inventions extend beyond the specificallydisclosed embodiments to other alternative embodiments and/or uses ofthe inventions and obvious modifications and equivalents thereof. Inaddition, other modifications which are within the scope of thisinvention will be readily apparent to those of skill in the art based onthis disclosure. It is also contemplated that various combination orsub-combination of the specific features and aspects of the embodimentsmay be made and still fall within the scope of the inventions. It shouldbe understood that various features and aspects of the disclosedembodiments can be combined with or substituted for one another in orderto form varying mode of the disclosed invention. Thus, it is intendedthat the scope of at least some of the present invention hereindisclosed should not be limited by the particular disclosed embodimentsdescribed above.

What is claimed is:
 1. A system comprising: a resistor; and a pluralityof chips, each chip of the plurality of chips including: a terminalcoupled to the resistor; and a calibration circuit configured todetermine whether the resistor is available based, at least in part, ontiming information unique to a corresponding chip.
 2. The system ofclaim 1, wherein the timing information of each chip of the plurality ofchips has a fixed duration of time common to the plurality of chips. 3.The system of claim 2, wherein the calibration circuit of each chip ofthe plurality of chips includes: a driver circuit coupled to theterminal; and an arbiter circuit configured to enable and disable thedriver circuit for the fixed duration of time based on the liminginformation unique to each respective chip among the plurality of chips.4. The system of claim 2, wherein the calibration circuit of each chipof the plurality of chips includes: a driver circuit coupled to theterminal; and an arbiter circuit configured to disable the drivercircuit to change a voltage of the terminal for a predetermined time inthe beginning of the fixed duration of time and further configured toenable the driver circuit after the predetermined time.
 5. The system ofclaim 1, wherein the calibration circuit of each chip of the pluralityof chips includes an arbiter circuit, and wherein an order in which theplurality of chips requesting calibration perform a calibrationoperation is determined by the arbiter circuits in the respective chipsof plurality of chips.
 6. The system of claim 1, wherein the resistor isshared among the plurality of chips.
 7. The system of claim 6, whereinthe driver circuit is a pull down circuit.
 8. The system of claim 6,wherein the driver circuit is a pull up circuit.
 9. The system of claim1, wherein the calibration circuit of each chip of the plurality ofchips includes: a driver circuit coupled to the terminal; and an arbitercircuit, and a calibration control circuit coupled to the drivercircuit, the calibration control circuit configured to adjust animpedance of the driver circuit after the calibration circuit determinesthat the resistor is available.
 10. The system of claim 1, wherein thecalibration circuit of each chip of the plurality of chips includes: adriver circuit coupled to the terminal; and an arbiter circuitconfigured to enable the driver circuit to change the voltage of theterminal before determining whether the resistor is available.
 11. Amethod comprising: detecting a voltage at a terminal of a chip among aplurality of chips, wherein the terminal is coupled to a resistor andwherein each chip of the plurality of chips is coupled to the resistor;enabling a driver circuit included in the chip for a duration of timebased on timing information having a fixed duration common to theplurality of chips; and determining whether the resistor is available,based, at least in part, on the timing information.
 12. The method ofclaim 11, further comprising pulling the voltage up or down for theduration of time based on the timing information, wherein thedetermining of whether the resistor is available is further based on thevoltage after pulling up the voltage.
 13. The method of claim 11,wherein the timing information includes a binary code assigned andsignaled as a timing pattern unique to the chip.
 14. The method of claim13, wherein the binary code is selected from a set of binary codeshaving a predetermined number of bits.
 15. The method of claim 14,wherein not any of the set of binary codes selected having thepredetermined number of bits are equal to a predetermined prohibitedcode having the predetermined number of bits.
 16. The method of claim11, wherein the determining of whether the resistor is available, based,at least in part, on the timing information includes comparing thedetected voltage at the terminal with a reference voltage.
 17. Anapparatus comprising: a resistor coupled to a power supply voltage; anda chip including: a terminal coupled to the resistor, and a calibrationcircuit configured to determine whether the resistor is available based,at least in part, on timing information unique to the chip.
 18. Theapparatus of claim 17, wherein the calibration circuit includes: adriver circuit coupled to the terminal; and an arbiter circuitconfigured to enable the driver circuit to change a voltage of theterminal before determining whether the resistor is available.
 19. Theapparatus of claim 17, wherein the calibration circuit includes a drivercircuit coupled to the terminal, wherein the driver circuit is a pulldown circuit, and wherein the resistor is determined to be availablewhen a voltage at the terminal is at a range of a logic high state. 20.The apparatus of claim 17, wherein the calibration circuit includes: adriver circuit coupled to the terminal; and an arbiter circuitconfigured to enable and disable the driver circuit based on the timinginformation.